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INTEGRATED CIRCUITS
DATA SHEET
PCD5094 DECT baseband controller
Objective specification File under Integrated Circuits, IC17 1997 Jul 21
Philips Semiconductors
Objective specification
DECT baseband controller
CONTENTS 1 1.1 2 3 4 5 5.1 5.2 6 7 8 8.1 8.2 8.3 8.4 9 10 11 FEATURES DSP software features GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FUNCTIONAL DESCRIPTION PACKAGE OUTLINE SOLDERING Introduction Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCD5094
1997 Jul 21
2
Philips Semiconductors
Objective specification
DECT baseband controller
1 FEATURES
PCD5094
* Easy interfacing with radio circuits, operating at other supply voltage (RF supply pin with level shifter for RF signals) * QFP100 package * Power-on-reset * Low power oscillator with integrated frequency adjustment * Low supply voltage (2.7 to 3.6 V) * CMOS technology. 1.1 DSP software features
* 80C51 ports P0, P1, P2 and P3 available for interfacing to display, keyboard, I2C-bus, interrupt sources and/or external memory. External program memory is addressable up to 128 kbytes * +2.7 to 5 V port (P0 to P3) interface * TDMA frame (de)multiplexing. Transmission or reception can be programmed for any slot * Ciphering, scrambling, CRC checking/generation and protected B-fields * Speech and data buffering space for six handsets * Local call and B-field loop-back * Two interrupt lines for BML and DSP to interrupt 80C51 * On-chip, three-channel time-multiplexed 8-bit Analog-to-Digital Converter (ADC) for RSSI measurement, one for battery voltage measurement and one channel available for other purposes * On-chip 8-bit Digital-to-Analog Converter (DAC) for electronic potentiometer function * Phase error measurement and phase error correction by hardware * DACs and ADCs for dynamic earpiece and dynamic or electret microphone * On-chip reference voltage * On-chip supply for electret microphone * Very low ohmic buzzer output * Serial interface to external ADPCM CODEC (PCD5032) or 8 kHz u-law samples * Speech switch for Digital Telephone Answering Machine (DTAM) connected to SPI interface * IOM-2 interface (Siemens registered trademark) * Serial interface to synthesizer for frequency programming * Programmable polarity and timing of radio-control signals * GMSK pulse shaper * On-chip comparator for use as data-slicer 3 ORDERING INFORMATION TYPE NUMBER PCD5094H
* ADPCM encoding and decoding complying with G.721 * u-law encoding and decoding complying with G.711 * Echo cancellation and network echo suppressor * Speech filters * Programmable gain in speech paths * Side tone and soft mute * Ringer and tone (DTMF) generator * Automatic gain control * Telephone Answering Machine (TAM) switch * TAM switch volume control * Conference between a/b line and two handsets. For each DSP software version a separate manual is available in which detailed information is provided on how parameters must be set. For further information please contact Philips Semiconductors. 2 GENERAL DESCRIPTION
The PCD5094 is designed for GAP-compliant basestations offering conference call between the a/b line and two handsets and answering machine switch. It has an embedded 80C51 microcontroller with twice the performance of the classic architecture, 64 kbytes of PROM program memory and 3 kbytes of data memory on chip. In addition there is 1 kbyte of on-chip data memory that is shared with on-chip Burst Mode Logic (BML) and DSP, the System Data RAM (SDR).
PACKAGE NAME QFP100 DESCRIPTION plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm VERSION SOT317-2
1997 Jul 21
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Objective specification
PCD5094
Fig.1 Block diagram.
handbook, full pagewidth
1997 Jul 21
PORT 1.0 to PORT 1.7 VDD_RF 5x VSS VSSA VDDA 2x VDD3V 3x VDD5V 8 8 8 PORT 2.0 to PORT 2.7 PORT 3.0 to PORT 3.7 8 PORT 1 PORT 3 IB-BUS PORT 2 digital pins analog pins
PORT 0.0 to PORT 0.7
VDD
PORT 0
Philips Semiconductors
BLOCK DIAGRAM
PCD5094
PSE EA ALE VDD
80CL51- CORE
A16
ROM (64 kBYTES) I2C-BUS TEST CONTROL BLOCK (TCB) TST1 TST2
AUX-RAM (3 kBYTES) MICROCONTROLLER-RAM (256 BYTES)
AB-MICROCONTROLLER INTERFACE (ABCIF) SPEECH INTERFACE IOM/ADPCM (SPI)
MICROCONTROLLER
DECT baseband controller
VDD_RF VDD BUZZER BUFFER (ABB) VDD VDDA VDD
VDD
DO DI FS1 DCK CLK3 BZP BZM
LEVEL SHIFTER 4fs 1-BIT ADC ARD ARF DIGITAL SIGNAL PROCESSOR (DSP) 4fs ATS 108fs 1-BIT ADC
DIGITAL NOISE SHAPER (DNS) 108fs
EARP EARM ARA LIFP LIFM MICP MICM AMP VMIC CDC-on
4
SYSTEM DATA RAM (SDR) (1 kBYTE) DIGITAL DECIMATING FILTER (DDF)
SLICE_CTR R_PWR R_ENABLE REF_CLK SYNTH_LOCK S_ENABLE S_CLK S_DATA VCO_BND_SW S_PWR ANT_SW0 ANT_SW1 T_ENABLE T_PWR_RMP T_DATA R_DATAP R_DATAM
BURST MODE LOGIC (BML)
R_SLICED
VDDA
T_GMSK
AGM
CODEC
Vref
DPLL_DATA VDDA AUXILIARY ADC (AAD) ANALOG VOLTAGE REFERENCE (AVR) Vref ANALOG VOLTAGE SOURCE (AVS) MUX 3:1 VADC PEAK-HOLD VANLI RSSI_AN SUBTRACT VBAT Vref ISB BUS CONTROLLER (IBC) DIGITAL CONTROL OF ANALOG (DCA) POWER-ON-RESET (POR)
GP_CLK7
VDD
CLOCK GENERATOR (CLG)
TIMING CONTROL BLOCK (TICB)
XTAL1 XTAL2
XTAL OSCILLATOR (XOSC)
WATCHDOG TIMER (WDT)
RESET GENERATOR (RGE)
CLK100
VDDO RESET_OUT M_RESET
VSSO
MBH944
EN_WATCHDOG
VBGP
VANLO
Philips Semiconductors
Objective specification
DECT baseband controller
5 5.1 PINNING INFORMATION Pinning
PCD5094
100 RESET_OUT
99 M_RESET
90 VDD5V_3
89 VSS5 88 EA
98 P0.0
97 P0.1
96 P0.2
95 P0.3
94 P0.4
93 P0.5
92 P0.6
91 P0.7
85 P2.7
84 P2.6
83 P2.5
82 P2.4
handbook, full pagewidth
ANT_SW1 ANT_SW0 CLK100 T_ENABLE T_PWR_RMP T_DATA T_GMSK VCO_BND_SW SYNTH_LOCK
1 2 3 4 5 6 7 8 9
81 P2.3 80 79 78 77 76 75 74 73 72 71 70 69 68 67
86 PSE
87 ALE
TST2 TST1 VSS4 VDD5V_2 A16 P2.2 P2.1 P2.0 P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 VSS3 VSS2 BZP BZM VDD3V_2 P1.7 P1.6 P1.5 P1.4 P1.3 VDD5V_1 R_SLICED DPLL_DATA GP_CLK7
S_ENABLE 10 S_DATA 11 S_CLK 12 S_PWR 13 REF_CLK 14 VSS1 15 VDD_RF 16 VDD3V_1 17 SLICE_CTR 18 R_PWR 19 R_DATAP R_DATAM R_ENABLE RSSI_AN VANLI VBAT CLK3 DCK DI FS1 DO 20 21 22 23 24 25 26 27 28 29 30 XTAL2 31 XTAL1 32 VANLO 33 VSSO 34 VDDO 35 LIFM 36 LIFP 37 VSSA 38 MICM 39 MICP 40 VMIC 41 Vref 42 VBGP 43 VDDA 44 EARM 45 EARP 46 EN_WATCHDOG 47 P1.0 48 P1.1 49 P1.2 50
PCD5094
66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
MBH943
Fig.2 Pin configuration (QFP100).
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
5.2 Pin description QFP100 package PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 I/O O O O O O O O O I O O O O O - - - O O I I O I I I O I/O I I/O O O I O - - STATE AFTER RESET H H H H L off L L - L L L H running - - - L H - - H - - - L input - input off running - 1.0 V - - PIN TYPE ISP2DRF3 ISP2DRF3 ISP2DPES ISP2DRF3 ISP2DRF3 ISF2DRF3 ANAIOD1 ISP2DRF3 DIPP0RF3 ISP2DRF3 ISP2DRF3 ISP2DRF3 ISP2DRF3 ISP4DRF3 supply supply supply ISP2DRF3 ISP2DRF3 ANAIOD2 ANAIOD2 ISP2DRF3 ANAIOD1 ANAIOD1 ANAIOD1 ISP2DPES ISF2DPES ISF2UPES DIPP0PES ISF2DPES ISF2UPES ISI8DPES ANAIOD1 ANAIOD1 ANAIOD1 supply supply PIN DESCRIPTION antenna switch 1 output antenna switch 0 output
PCD5094
Table 1
SYMBOL ANT_SW1 ANT_SW0 CLK100 T_ENABLE T_PWR_RMP T_DATA T_GMSK VCO_BND_SW SYNTH_LOCK S_ENABLE S_DATA S_CLK S_PWR REF_CLK VSS1 VDD_RF VDD3V_1 SLICE_CTR R_PWR R_DATAP R_DATAM R_ENABLE RSSI_AN VANLI VBAT CLK3 DCK DI FS1 DO XTAL2 XTAL1 VANLO VSSO VDDO
100 Hz signal related to DECT frame timing output enable transmitter output switch transmitter power output unmodulated transmitter data output GMSK modulated transmitter data output VCO band switch output synthesizer lock input synthesizer enable output serial synthesizer data output clock for serial synthesizer interface output switch synthesizer power output 13.824 MHz reference clock for synthesizer output negative supply voltage 1 positive supply voltage for RF interface level shifters positive supply voltage 1 (+3 V) switch slicer time constant output switch receiver power output positive input for receiver data negative input for receiver data enable receiver output analog input for RSSI measurement analog input to ADC analog input for battery voltage measurement 3.456 MHz clock output for external ADPCM codec ADPCM output or IOM data clock input/output (ISF2UPES in PCD5090/xxx, PCA5097/xxx) ADPCM or IOM data input 8 kHz framing input/output (ISF2UPES in PCD5090/xxx, PCA5097/xxx) ADPCM or IOM data output crystal oscillator output crystal oscillator input analog output from D/A converter negative supply voltage for the oscillator positive supply voltage for the oscillator
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
PCD5094
SYMBOL LIFM LIFP VSSA MICM MICP VMIC Vref VBGP VDDA EARM EARP EN_WATCHDOG P1.0 P1.1 P1.2 GP_CLK7 DPLL_DATA R_SLICED VDD5V_1 P1.3 P1.4 P1.5 P1.6 P1.7 VDD3V_2 BZM BZP VSS2 VSS3 P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P2.0 P2.1 1997 Jul 21
PIN 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74
I/O I I - I I O O O - O O I I/O I/O I/O O O O - I/O I/O I/O I/O I/O - O O - - I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
STATE AFTER RESET 0.7 V 0.7 V - 0.7 V 0.7 V off 2.0 V 1.25 V - 1.4 V 1.4 V - H H H L L L - H H H off off - L L - - H H H H H H H H H H
PIN TYPE ANAIOD1 ANAIOD1 supply ANAIOR1 ANAIOR1 ANAIOD1 ANAIOD1 ANAIOR1 supply ANAIOD1 ANAIOD1 DIUP0PES ISQ2CPES ISQ2CPES ISQ2CPES ISP2DPES ISP2DPES ISP2DPES supply ISQ2CPES ISQ2CPES ISQ2CPES ISI8DPES ISI8DPES supply ANAIOD2 ANAIOD2 supply supply ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES 7
PIN DESCRIPTION negative input from line interface positive input from line interface negative supply voltage for analog circuits negative input from microphone positive input from microphone positive microphone supply voltage (+2 V) reference voltage (+2 V) bandgap output voltage (+1.25 V) positive supply voltage for analog circuits negative output to earpiece positive output to earpiece watchdog enable input bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin general purpose 6.912 MHz output data after clock recovery network R_DATA comparator output positive supply voltage 1 for the +5 V interface bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin positive supply voltage 2 (+3 V) negative buzzer output positive buzzer output negative supply voltage 2 negative supply voltage 3 bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin
Philips Semiconductors
Objective specification
DECT baseband controller
PCD5094
SYMBOL P2.2 A16 VDD5V_2 VSS4 TST1 TST2 P2.3 P2.4 P2.5 P2.6 P2.7 PSE ALE EA VSS5 VDD5V_3 P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 M_RESET RESET_OUT
PIN 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
I/O I/O O - - I I I/O I/O I/O I/O I/O O O I - - I/O I/O I/O I/O I/O I/O I/O I/O I O
STATE AFTER RESET H L - - - - H H H H H H H - - - off H off H off H off H off H off H off H off H - H
PIN TYPE ISQ2CPES ISP4DPES supply supply DIDP0PES DIDP0PES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ2CPES ISQ4CPES ISF2DPES supply supply ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES ISP2DPES ISQ2CPES DIDP0PES ISF2DPES
PIN DESCRIPTION bidirectional 80C51 port pin address bit 16 for 128 kbytes external program memory positive supply voltage 2 for the +5 V interface negative supply voltage 4 test input 1 test input 2 bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin bidirectional 80C51 port pin program store enable (80C51); active LOW address latch enable (80C51) external access enable (80C51); active LOW negative supply voltage 5 positive supply voltage 3 for the +5 V interface bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) bidirectional 80C51 port pin (ISQ2CPES in PCD5090/xxx, PCA5097/xxx) master reset input (Schmitt trigger) reset output
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
6 FUNCTIONAL DESCRIPTION
PCD5094
The PCD509x is a family of single-chip controllers, designed for use in Digital Enhanced Cordless Telecommunications systems (DECT). The family is designed for minimum component-count and minimum power consumption. All controllers include an embedded 80C51 microcontroller with on-chip memory and I2C-bus. The Philips DECT RF interface is implemented. The Burst Mode Logic (BML) performs the time-critical MAC layer functions for applications in DECT handsets and base stations. The ADPCM transcoding is in compliance with the CCITT recommendation G.721 and includes receive and transmit filters.
handbook, full pagewidth
EARPIECE RADIO CIRCUITS PCD5091 MICROPHONE
MGD797
a. Handset.
handbook, full pagewidth
RADIO CIRCUITS
PCD5092/ PCD5094
LINE INTERFACE (e.g. TEA1118)
a/b line u-law TAM switch
MBH945
b. Basestation (PCD5094) with analog interface and echo cancellation; up to 6 portables can be handled.
handbook, full pagewidth
EARPIECE RADIO CIRCUITS PCD5093 MICROPHONE 2
MBH939
Handsfree
2 x IOM or 2 x ADPCM-CODEC or a combination
Interface to ISDN or n-line analog line interface (PCD5096)
c. Base with digital interface and analog corded handset connected; up to 6 portables can be handled.
Fig.3 Block diagrams of DECT systems with PCX509x.
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
7 PACKAGE OUTLINE
PCD5094
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
c
y X
80 81
51 50 ZE
A
e E HE A A2 A1
Q (A 3) Lp L detail X
wM pin 1 index bp 100 1 wM D HD ZD B vM B 30 vMA 31
e
bp
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 3.20 A1 0.25 0.05 A2 2.90 2.65 A3 0.25 bp 0.40 0.25 c 0.25 0.14 D (1) 20.1 19.9 E (1) 14.1 13.9 e 0.65 HD 24.2 23.6 HE 18.2 17.6 L 1.95 Lp 1.0 0.6 Q 1.4 1.2 v 0.2 w 0.15 y 0.1 Z D (1) Z E(1) 0.8 0.4 1.0 0.6 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT317-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
8 8.1 SOLDERING Introduction 8.3 Wave soldering
PCD5094
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 8.2 Reflow soldering
Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 8.4 Repairing soldered joints
Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our "Quality Reference Handbook" (order code 9397 750 00192). Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
9 DEFINITIONS
PCD5094
Data sheet status Objective specification Preliminary specification Product specification Short-form specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 10 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 11 PURCHASE OF PHILIPS I2C COMPONENTS This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
NOTES
PCD5094
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
NOTES
PCD5094
1997 Jul 21
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Philips Semiconductors
Objective specification
DECT baseband controller
NOTES
PCD5094
1997 Jul 21
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
437027/00/01/pp16
Date of release: 1997 Jul 21
Document order number:
9397 750 01659

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